JPH0415841U - - Google Patents
Info
- Publication number
- JPH0415841U JPH0415841U JP1990058399U JP5839990U JPH0415841U JP H0415841 U JPH0415841 U JP H0415841U JP 1990058399 U JP1990058399 U JP 1990058399U JP 5839990 U JP5839990 U JP 5839990U JP H0415841 U JPH0415841 U JP H0415841U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- tab type
- manufacturing apparatus
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990058399U JPH087635Y2 (ja) | 1990-05-31 | 1990-05-31 | Ｔａｂ式半導体装置の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990058399U JPH087635Y2 (ja) | 1990-05-31 | 1990-05-31 | Ｔａｂ式半導体装置の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415841U true JPH0415841U (en]) | 1992-02-07 |
| JPH087635Y2 JPH087635Y2 (ja) | 1996-03-04 |
Family
ID=31583974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990058399U Expired - Fee Related JPH087635Y2 (ja) | 1990-05-31 | 1990-05-31 | Ｔａｂ式半導体装置の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087635Y2 (en]) |
-
1990
- 1990-05-31 JP JP1990058399U patent/JPH087635Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087635Y2 (ja) | 1996-03-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |